BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//YourOrganization//EventDownload//DE
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:69e4ad281d80d@leapup.bitshifters.cloud
DTSTAMP:20260419T122336Z
DTSTART:20230628T160000Z
DTEND:20230628T170000Z
SUMMARY:Chiplet based Sensor fusion platform for autonomous driving and AGVs
DESCRIPTION:Based on the state of the art of integration technologies\, our webinar shows possible integration approaches for chiplet based multi die systems to build future sensor fusion platforms&nbsp\;e.g. for ADAS and AGV application. Furthermore\, we discuss current and future chip to chip standards and their advantages and disadvantages for automotive and AGV&nbsp\;applications.\nMore
LOCATION:Fraunhofer IIS/EAS\, Dresden
END:VEVENT
END:VCALENDAR