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CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:69e4b96d9988b@leapup.bitshifters.cloud
DTSTAMP:20260419T131557Z
DTSTART:20221012T160000Z
DTEND:20221012T170000Z
SUMMARY:More than Moore via 2.5D IC integration technology - Automotive electronic control unit (ECU) for ADAS application based on a Chiplet approach
DESCRIPTION:Based on the state of the art of integration technologies\, our webinar shows possible integration approaches for chiplet based multi die systems to build future ECU architecture e.g. for ADAS application. Furthermore\, we discuss current and future chip to chip standards and their advantages and disadvantages for automotive applications.
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